LOOM TREE Silicone Thermal Pad 12.8 W/mK Heat Resistance Simple for PC Laptop Heatsink 1.5mm

The LOOM TREE Silicone Thermal Pad is a high-quality product designed to provide efficient heat dissipation for PC and laptop heatsinks.

Key Features: - Thermal conductivity of 12.8 W/mK - Heat resistance - Ultra-thin design at 1.5mm thickness - Easy to install and remove

For Whom: This product is ideal for anyone looking to improve the cooling system of their PC or laptop, especially for gamers, graphic designers, and other heavy users who put their devices under intense workloads.

Pros: - Excellent thermal conductivity for efficient heat dissipation - Thin design does not add bulk to the device - Easy to use and install - Durable silicone material for long-lasting performance

Cons: - May not be compatible with all heatsink sizes - Some users may prefer a thicker thermal pad for better heat transfer

Factor	Weight	Contribution	Rationale	Sources
Spec/Feature Fit	25	20	High thermal conductivity and heat resistance suitable for PC and laptop use.	notebookcheck
Brand Strength	20	10	LOOM TREE known for quality thermal solutions.	TechRadar
Category Momentum	20	15	Growing demand for thermal paste in Indian market.	Gartner, IDC
Price Positioning	20	10	Competitively priced compared to similar products in the market.	Flipkart, Amazon
Competition	10	6	Facing moderate competition from established thermal paste brands.	—
Use-case Advantage	5	5	Versatile application for various heat sink needs.	—
Final Market Score	100	66/100 (3.30/5)	LOOM TREE Silicone Thermal Pad offers a balanced value proposition in the Indian thermal paste market.

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