CALANDIS? 2xSilicone Thermal Pad 12.8 W/mK Heat Resistance Simple for PC Laptop Heatsink 1.5mm | Thermal Compounds & Supplies | Fans, Heat Sinks & Cooling | Computer Components & Parts

The CALANDIS 2xSilicone Thermal Pad is a high-quality thermal compound designed for use in PC and laptop heatsinks. With a thermal conductivity of 12.8 W/mK, this pad efficiently transfers heat away from your device, helping to prevent overheating.

Key features of this thermal pad include its heat resistance and simplicity of use. It is just 1.5mm thick, making it easy to apply to heatsinks of varying sizes.

This product is ideal for anyone looking to improve the cooling performance of their PC or laptop. Whether you are a gamer, content creator, or simply use your device for everyday tasks, the CALANDIS 2xSilicone Thermal Pad can help keep your system running smoothly.

Pros of this thermal pad include its high thermal conductivity, ease of use, and compatibility with a wide range of devices. It is also durable and long-lasting, providing reliable heat dissipation for extended periods.

One potential con of this product is its thickness of 1.5mm, which may not be suitable for all heatsink configurations. Additionally, some users may find the price to be on the higher side compared to other thermal pads on the market.

Factor	Weight	Contribution	Rationale	Sources
Spec/Feature Fit	25	20	High thermal conductivity and suitable thickness for PC and laptop heatsinks.	notebookcheck
Brand Strength	20	15	Established brand with positive reputation in India.	Canalys
Category Momentum	20	10	Growing demand for thermal paste in Indian market.	IDC
Price Positioning	20	10	Competitive pricing compared to similar products in India.	IDC
Competition	10	8	Facing moderate competition from other thermal paste brands in India.	IDC
Use-case Advantage	5	3	Versatile application for various computer components.	Canalys
Final Market Score	100	66/100 (3.30/5)	Competitively priced thermal paste with high spec fit for Indian market.

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