B0DL2KXVH3 Heat Compound 500gm
Smart Rank ⓘ
40/100
Based on Market Score (66/100) and aggregated marketplace rating with volume weighting.
Why you’ll like it
- Optimize cooling performance with high thermal conductivity for efficient heat transfer
- Versatile 500gm size allows for multiple applications in various electronic devices
- Easy reapplication with non-curing formula, suitable for DIY computer builders and enthusiasts
- Silicone-based compound compatible with a wide range of surfaces, ideal for system integrators
Market-Based Score (India)
66/100 (3.30/5)
Decent Strong product fit in the Indian thermal paste market segment.
Reviews across marketplaces
| Platform | Rating | Reviews |
|---|---|---|
| amazon | 0★ | 0 |
| Total / Avg | 0.00★ | 0 |
Consensus:
0.00★ from 0 total reviews
Rs.999.00 Rs.1,399.00
Best price from
Amazon.in
Amazon.in
Details
This heat sink compound is a high-quality thermal compound designed to improve heat transfer from a CPU or GPU to its heat sink. It is ideal for use in computer systems, gaming consoles, and other electronic devices that require efficient cooling.
Key Features: - 500gm size for multiple applications - High thermal conductivity for effective heat transfer - Non-curing formula for easy reapplication - Silicone-based for compatibility with a wide range of surfaces
For whom: This heat sink compound is perfect for DIY computer builders, system integrators, and electronic enthusiasts looking to optimize the cooling performance of their devices. It is also suitable for repairing or upgrading existing cooling systems.
Pros: - Large 500gm size for multiple applications - High thermal conductivity for efficient heat transfer - Easy to apply and reapply as needed - Compatible with a wide range of surfaces
Cons: - May be a bit messy to apply for beginners - Requires proper cleaning before reapplication to ensure optimal performance
Key Features: - 500gm size for multiple applications - High thermal conductivity for effective heat transfer - Non-curing formula for easy reapplication - Silicone-based for compatibility with a wide range of surfaces
For whom: This heat sink compound is perfect for DIY computer builders, system integrators, and electronic enthusiasts looking to optimize the cooling performance of their devices. It is also suitable for repairing or upgrading existing cooling systems.
Pros: - Large 500gm size for multiple applications - High thermal conductivity for efficient heat transfer - Easy to apply and reapply as needed - Compatible with a wide range of surfaces
Cons: - May be a bit messy to apply for beginners - Requires proper cleaning before reapplication to ensure optimal performance
Market-Based Score — Breakdown
| Factor | Weight | Contribution | Rationale | Sources |
|---|---|---|---|---|
| Spec/Feature Fit | 25 | 20 | Product specifications align well with market requirements. | Gartner |
| Brand Strength | 20 | 10 | Recognized brands have established trust in this segment. | Canalys |
| Category Momentum | 20 | 15 | Growing demand for thermal management solutions in Indian market. | IDC |
| Price Positioning | 20 | 10 | Competitive pricing compared to alternatives in the market. | Forrester |
| Competition | 10 | 6 | Facing moderate competition from established and new players. | TechCrunch |
| Use-case Advantage | 5 | 5 | Offers unique benefits for specific thermal management needs. | TechRadar |
| Final Market Score | 100 | 66/100 (3.30/5) | Strong product fit in the Indian thermal paste market segment. | |
Market-Based Score
66/100 (3.30/5)
-
Spec/Feature Fit 20/25
Weight: 25Contribution: 20Rationale: Product specifications align well with market requirements.Sources: Gartner -
Brand Strength 10/20
Weight: 20Contribution: 10Rationale: Recognized brands have established trust in this segment.Sources: Canalys -
Category Momentum 15/20
Weight: 20Contribution: 15Rationale: Growing demand for thermal management solutions in Indian market.Sources: IDC -
Price Positioning 10/20
Weight: 20Contribution: 10Rationale: Competitive pricing compared to alternatives in the market.Sources: Forrester -
Competition 6/10
Weight: 10Contribution: 6Rationale: Facing moderate competition from established and new players.Sources: TechCrunch -
Use-case Advantage 5/5
Weight: 5Contribution: 5Rationale: Offers unique benefits for specific thermal management needs.Sources: TechRadar
Summary
Strong product fit in the Indian thermal paste market segment.
Quick Compare
Rs.1,399.00
⭐ Reviews Summary
✅ What Users Love
- Effective in improving heat dissipation
- Easy to apply
- Good value for the price
⚠️ What to Watch
- May dry out quickly
- Some users reported messy application
- Packaging could be improved
Rs.1,400.00
⭐ Reviews Summary
✅ What Users Love
- Effective thermal conductivity
- Easy application with syringe
- Suitable for various electronic components
⚠️ What to Watch
- Small quantity for the price
- May dry out quickly
- Some users reported inconsistent performance
Rs.1,412.00
⭐ Reviews Summary
✅ What Users Love
- Good thermal conductivity
- Easy to apply with syringe
- Compatible with various electronic components
⚠️ What to Watch
- Small quantity for the price
- May dry out quickly
- Some users reported inconsistent performance
Rs.14,220.80
⭐ Reviews Summary
✅ What Users Love
- Effective thermal conductivity
- Easy to apply
- Good value for the quantity
⚠️ What to Watch
- Messy application process
- May dry out quickly
- Packaging could be improved
Where to Buy
Price Comparison
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More Detail
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Heat Sink Compound 500gm Estimated Delivery: 2-3 days
In Stock
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Rs.999.00 Rs.1,399.00 COD
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GO TO STORE GO TO STORE |
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Heat Sink Compound 500gm Estimated Delivery: 2-3 days
In Stock
COD
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