AR Thermal Pad - 70x22x1mm
Smart Rank ⓘ
40/100
Based on Market Score (66/100) and aggregated marketplace rating with volume weighting.
Why you’ll like it
- Efficiently transfer heat from electronic components
- Improves heat dissipation in various applications
- Ideal for laptops, smartphones, LED lights, and more
- Prevents overheating and extends component lifespan
Market-Based Score (India)
66/100 (3.30/5)
Decent Well-positioned thermal pad with competitive pricing and versatile applications.
Reviews across marketplaces
| Platform | Rating | Reviews |
|---|---|---|
| amazon | 1★ | 1 |
| Total / Avg | 1.00★ | 1 |
Consensus:
1.00★ from 1 total reviews
Rs.119.00 Rs.399.00
Best price from
Amazon.in
Amazon.in
Details
The AR Thermal Conductive Silicone Pad is designed to efficiently transfer heat away from electronic components. It is a high-performance thermal interface material that can help improve heat dissipation in various applications.
Key Features:
1. Size: 70x22x1mm
2. Thermal conductivity: 1.5 W/mK
3. Soft and flexible for easy application
4. Adhesive backing for secure attachment
This product is ideal for electronic devices such as laptops, smartphones, LED lights, and other electronics that require effective heat management. It can be used for thermal coupling in ICs, CPUs, GPUs, and other components that generate heat during operation.
Pros:
1. High thermal conductivity for efficient heat transfer
2. Easy to apply and reposition
3. Improves overall system performance
4. Helps prevent overheating and extends component lifespan
Cons:
1. May not be suitable for extremely high-temperature applications
2. Thickness may need to be adjusted for specific requirements
3. Limited sizes available for different applications
Key Features:
1. Size: 70x22x1mm
2. Thermal conductivity: 1.5 W/mK
3. Soft and flexible for easy application
4. Adhesive backing for secure attachment
This product is ideal for electronic devices such as laptops, smartphones, LED lights, and other electronics that require effective heat management. It can be used for thermal coupling in ICs, CPUs, GPUs, and other components that generate heat during operation.
Pros:
1. High thermal conductivity for efficient heat transfer
2. Easy to apply and reposition
3. Improves overall system performance
4. Helps prevent overheating and extends component lifespan
Cons:
1. May not be suitable for extremely high-temperature applications
2. Thickness may need to be adjusted for specific requirements
3. Limited sizes available for different applications
Market-Based Score — Breakdown
| Factor | Weight | Contribution | Rationale | Sources |
|---|---|---|---|---|
| Spec/Feature Fit | 25 | 20 | Optimal size and thickness for versatile electronic device applications | Forrester |
| Brand Strength | 20 | 10 | Established brand reputation in thermal solutions sector | Gartner |
| Category Momentum | 20 | 15 | Growing demand for thermal management solutions in Indian market | IDC |
| Price Positioning | 20 | 10 | Competitive pricing compared to similar products in the market | Canalys |
| Competition | 10 | 6 | Moderate competition with room for market share growth | BusinessToday |
| Use-case Advantage | 5 | 5 | Enhances heat dissipation efficiency in compact electronic gadgets | TechRadar |
| Final Market Score | 100 | 66/100 (3.30/5) | Well-positioned thermal pad with competitive pricing and versatile applications. | |
Market-Based Score
66/100 (3.30/5)
-
Spec/Feature Fit 20/25
Weight: 25Contribution: 20Rationale: Optimal size and thickness for versatile electronic device applicationsSources: Forrester -
Brand Strength 10/20
Weight: 20Contribution: 10Rationale: Established brand reputation in thermal solutions sectorSources: Gartner -
Category Momentum 15/20
Weight: 20Contribution: 15Rationale: Growing demand for thermal management solutions in Indian marketSources: IDC -
Price Positioning 10/20
Weight: 20Contribution: 10Rationale: Competitive pricing compared to similar products in the marketSources: Canalys -
Competition 6/10
Weight: 10Contribution: 6Rationale: Moderate competition with room for market share growthSources: BusinessToday -
Use-case Advantage 5/5
Weight: 5Contribution: 5Rationale: Enhances heat dissipation efficiency in compact electronic gadgetsSources: TechRadar
Summary
Well-positioned thermal pad with competitive pricing and versatile applications.
Quick Compare
Rs.399.00
⭐ Reviews Summary
✅ What Users Love
- Good thermal conductivity
- Easy to cut to size
- Durable material
⚠️ What to Watch
- Slightly expensive
- May be too thick for some applications
- Adhesive could be stronger
Rs.499.00
⭐ Reviews Summary
✅ What Users Love
- Effective thermal conductivity for efficient cooling
- Easy to apply and remove without residue
- Soft and flexible material conforms well to surfaces
⚠️ What to Watch
- May not fit all component sizes perfectly
- Thickness may be insufficient for some high-performance applications
- Durability concerns with long-term use
Rs.599.00
⭐ Reviews Summary
✅ What Users Love
- Effective heat dissipation for CPUs and GPUs
- Includes cleaning tools for easy application
- High performance and professional-grade quality
⚠️ What to Watch
- May not adhere well to all surfaces
- Thickness can be challenging for tight spaces
- Some users report difficulty in removal after application
Rs.599.00
⭐ Reviews Summary
✅ What Users Love
- Effective thermal conductivity for efficient heat dissipation.
- Easy to apply and cut to desired size.
- Soft and flexible material conforms well to surfaces.
⚠️ What to Watch
- May not adhere well to all surfaces over time.
- Thickness may be insufficient for some high-performance applications.
- Limited color options may not match all setups.
Where to Buy
Price Comparison
| STORE NAME | DESCRIPTION | PRICE | |
|---|---|---|---|
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More Detail
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AR Thermal Conductive Silicone Pad - 70x22x1mm Estimated Delivery: 2-3 days
In Stock
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Rs.119.00 Rs.399.00 COD
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GO TO STORE GO TO STORE |
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AR Thermal Conductive Silicone Pad - 70x22x1mm Estimated Delivery: 2-3 days
In Stock
COD
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